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RF/Microwave Hybrids

Basics, Materials and Processes

  • Book
  • © 2003

Overview

Authors:
  1. Richard Brown

    1. Richard Brown Associates, Inc., Shelton

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Table of contents (17 chapters)

  1. Front Matter

    Pages i-xv
    Download chapter PDF

  2. Hybrids vs. Mimics

    Pages 1-4

  3. Basic Concepts

    Pages 5-11

  4. Planar Waveguides

    Pages 13-27

  5. Current Flow and Loss Considerations

    Pages 29-53

  6. Substrates

    Pages 55-92

  7. Thick Film

    Pages 93-111

  8. Thin Film

    Pages 113-121

  9. Dielectric Deposition

    Pages 123-127

  10. Polymers

    Pages 129-140

  11. Processing Strategies

    Pages 141-142

  12. Photolithigraphy

    Pages 143-167

  13. Electroplating

    Pages 169-184

  14. Etching

    Pages 185-193

  15. Components

    Pages 195-228

  16. Packaging

    Pages 229-255

  17. Superconductivity

    Pages 257-268

  18. Microelectromechnicalsystems-MEMS

    Pages 269-270

  19. Back Matter

    Pages 271-283
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Keywords

About this book

In 1991 this author published a monograph[l] based on his experience teaching microwave hybrid materials and processing technology at the annual ISHM (now the International Microelectronics and Packaging Society, IMAPS) symposia. Since that time, the course has been presented at that venue and on-site at a number of industrial and government organizations. The course has been continually revised to reflect the many evolutionary changes in materials and processes. Microwave technology has existed for almost 175 years. It was only after the invention of the klystron, just before World War II, that microwave design and manufacture moved from a few visionaries to the growth the industry sees today. Over the last decade alone there have been exploding applications for all types of high frequency electronics in the miltary, automotive, wireless, computer, telecommunications and medical industries. These have placed demands, unimaginable a decade ago, on designs, materials, processes and equipment to meet the ever expanding requirements for increasingly reliable, smaller, faster and lower cost circuits.

Authors and Affiliations

  • Richard Brown Associates, Inc., Shelton

    Richard Brown

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