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Directions for the Next Generation of MMIC Devices and Systems

  • Book
  • © 1997

Overview

Editors:
  1. Nirod K. Das

    1. Weber Research Institute, Polytechnic University, Farmingdale, USA

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    You can also search for this editor in PubMed   Google Scholar

  2. Henry L. Bertoni

    1. Weber Research Institute, Polytechnic University, Brooklyn, USA

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Table of contents (46 chapters)

  1. Front Matter

    Pages i-xi
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  3. Systems and Integration

    1. Front Matter

      Pages 35-35
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    2. High Density Microwave Packaging Technology Development for Department of Defense Applications

      • Franklin Lamb, Bradley Paul, Christopher Lesniak
      Pages 37-44

    3. Flip Chip Power MMICS Packaging Technology

      • Terry C. Cisco
      Pages 45-52

    4. Multilevel Vertical Interconnection Technology

      • Francois Y. Colomb
      Pages 53-60

    5. Multilevel Packaging for Low Cost Microwave Functions

      • G. Brehm, R. Peterson, H. Tserng, D. Purinton, A. Ketterson, B. Ables
      Pages 61-68

    6. Future Applications of Millimeter Technology

      • Robert McLaughlin
      Pages 69-74

    7. Distributed Power Combining and Signal Processing in a 2D Quasi-Optical System

      • James F. Harvey, Michael B. Steer, Huan-Sheng Hwang, Todd. W. Nuteson, Chris W. Hicks, James W. Mink
      Pages 75-82

    8. Multilayer Integration of Microwave and Millimeter-Wave Circuits: New Interconnect Methods and Design Considerations

      • N. K. Das, N. Herscovici, G. Kwan, D. M. Bolle
      Pages 83-95

    9. The Hybrid Integration Technique of Planar and NRD-Guide Circuits for Millimeter-Wave Applications

      • Ke Wu, Liang Han
      Pages 97-104

    10. Solder Free Interconnects for High Density Phased Array Integration

      • D. Strack, H. Fudem, F. Kuss, W. Marsh
      Pages 105-111

    11. Silicon Based On-Wafer and Discrete Packaging

      • Rashaunda M. Henderson, Linda P. B. Katehi
      Pages 113-120

    12. Patch-MMIC-Ferrite Integration in Novel Phased Array Technology

      • Ernst F. Zaitsev, Yu. P. Yavon, Anton B. Guskov, George A. Yufit
      Pages 121-128

  4. Novel Antennas and Device Technology

    1. Front Matter

      Pages 129-129
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    2. Broadbanding Guide Lines of Strip-Element Microstrip Phased Arrays

      • A. Hessel
      Pages 131-144
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Keywords

Editors and Affiliations

  • Weber Research Institute, Polytechnic University, Farmingdale, USA

    Nirod K. Das

  • Weber Research Institute, Polytechnic University, Brooklyn, USA

    Henry L. Bertoni

Bibliographic Information

  • Book Title: Directions for the Next Generation of MMIC Devices and Systems

  • Editors: Nirod K. Das, Henry L. Bertoni

  • DOI: https://doi.org/10.1007/978-1-4899-1480-4

  • Publisher: Springer New York, NY

  • eBook Packages: Springer Book Archive

  • Copyright Information: Springer Science+Business Media New York 1997

  • Hardcover ISBN: 978-0-306-45769-2Published: 30 November 1997

  • Softcover ISBN: 978-1-4899-1482-8Published: 02 August 2013

  • eBook ISBN: 978-1-4899-1480-4Published: 11 November 2013

  • Edition Number: 1

  • Number of Pages: XI, 415

  • Topics: Electrical Engineering, Magnetism, Magnetic Materials

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