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Multichip Modules with Integrated Sensors

  • Book
  • © 1996
  • Latest edition

Overview

Editors:
  1. W.K. Jones

    1. Florida International University Dept. Mechanical Engineering, Miami, USA

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    You can also search for this editor in PubMed   Google Scholar

  2. Gábor Harsányi
    View editor publications

    You can also search for this editor in PubMed   Google Scholar

Part of the book series: NATO Science Partnership Subseries: 3 (ASHT, volume 16)

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About this book

Advances in electronic devices with higher speeds and complexity have placed higher demands on the electronic packaging of systems. Multichip Modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capabilities have recently evolved to address these new requirements. Under the auspices of the NATO Science Committee an Advanced Research Workshop (ARW) on Multichip Modules with Integrated Sensors was hosted by the Technical University of Budapest, Budapest, Hungary, on May 18-20, 1995. Additionally, the Hungarian Chapter of ISHM-The Microelectronics Society held a poster session on this topic. This volume presents the majority of papers presented at the ARW and the ISHM-Hungary Session. The integration of sensors with high .performance MCM structures represent the trend for intelligent electronics. The book reviews advances in MCM technology, including ceramic based MCM-C, thin film MCM-D and organic laminate based MCM-L. Sensors based on micromachined silicon structures, thin, and thick film technology are reviewed. Applications of MCM to higher level integration and sensor integration and reliability impacts are presented. Developments in materials and processes for both MCM and sensors have lead to the enhanced performance of smart electronics. The work of the ARW, as demonstrated in the papers, addressed new materials development, characterized methods and high level integration of sensors into electronic packaging.

Editors and Affiliations

  • Florida International University Dept. Mechanical Engineering, Miami, USA

    W.K. Jones

Bibliographic Information

  • Book Title: Multichip Modules with Integrated Sensors

  • Editors: W.K. Jones, Gábor Harsányi

  • Series Title: NATO Science Partnership Subseries: 3

  • Publisher: Springer Dordrecht

  • eBook Packages: Springer Book Archive

  • Copyright Information: Kluwer Academic Publishers 1996

  • Hardcover ISBN: 978-0-7923-4194-9Due: 31 October 1996

  • Softcover ISBN: 978-94-010-6631-0Published: 06 October 2011

  • Series ISSN: 1388-6576

  • Edition Number: 1

  • Number of Pages: 336

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