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Electronic Packaging for High Reliability, Low Cost Electronics

  • Book
  • © 1998

Overview

Editors:
  1. R.R. Tummala

    1. Georgia Institute of Technology Manufacturing Research Center, Atlanta, USA

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  2. Marija Kosec

    1. Jožef Stefan Institute, Ljubljana, Slovenia

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  3. W.K. Jones

    1. Florida International University Dept. Mechanical Engineering, Miami, USA

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  4. Darko Belavic
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Part of the book series: NATO Science Partnership Subseries: 3 (ASHT, volume 57)

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About this book

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

Editors and Affiliations

  • Georgia Institute of Technology Manufacturing Research Center, Atlanta, USA

    R.R. Tummala

  • Jožef Stefan Institute, Ljubljana, Slovenia

    Marija Kosec

  • Florida International University Dept. Mechanical Engineering, Miami, USA

    W.K. Jones

Bibliographic Information

  • Book Title: Electronic Packaging for High Reliability, Low Cost Electronics

  • Editors: R.R. Tummala, Marija Kosec, W.K. Jones, Darko Belavic

  • Series Title: NATO Science Partnership Subseries: 3

  • Publisher: Springer Dordrecht

  • Copyright Information: Springer Science+Business Media B.V. 1998

  • Hardcover ISBN: 978-0-7923-5218-1Published: 29 February 2000

  • Softcover ISBN: 978-90-481-5085-4Published: 03 December 2010

  • Series ISSN: 1388-6576

  • Edition Number: 1

  • Number of Pages: X, 296

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