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Table of contents (6 chapters)
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Front Matter
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Back Matter
Authors and Affiliations
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Stanford University, USA
Y. Sungtaek Ju, Kenneth E. Goodson
Bibliographic Information
Book Title: Microscale Heat Conduction in Integrated Circuits and Their Constituent Films
Authors: Y. Sungtaek Ju, Kenneth E. Goodson
Series Title: Microsystems
DOI: https://doi.org/10.1007/978-1-4615-5211-6
Publisher: Springer New York, NY
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eBook Packages: Springer Book Archive
Copyright Information: Springer Science+Business Media New York 1999
Hardcover ISBN: 978-0-7923-8591-2Published: 31 August 1999
Softcover ISBN: 978-1-4613-7374-2Published: 02 November 2012
eBook ISBN: 978-1-4615-5211-6Published: 06 December 2012
Series ISSN: 1389-2134
Edition Number: 1
Number of Pages: XXI, 102
Topics: Electrical Engineering, Optical and Electronic Materials, Classical Mechanics