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Structural Integrity

Advanced Thermal Stress Analysis of Smart Materials and Structures

Authors: Chen, Zengtao, Akbarzadeh, Hamid

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  • A first monograph on thermal stress analysis based on non-Fourier heat conduction theories
  • Includes applications of non-Fourier heat conduction in thermal stress analysis of smart materials and structures
  • Summarizies non-Fourier heat conduction theories, an emerging topic in thermal fluids
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Buy this book

eBook $109.00
price for USA (gross)
  • ISBN 978-3-030-25201-4
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $179.99
price for USA
  • ISBN 978-3-030-25200-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
About this book

This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. 

The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book  provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry.

A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends with coupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authors propose directions for future research on the topic of multiphysical analysis of smart materials.       




Table of contents (7 chapters)

Table of contents (7 chapters)
  • Heat Conduction and Moisture Diffusion Theories

    Pages 1-22

    Chen, Prof. Dr. Zengtao (et al.)

  • Basic Problems of Non-Fourier Heat Conduction

    Pages 23-63

    Chen, Prof. Dr. Zengtao (et al.)

  • Multiphysics of Smart Materials and Structures

    Pages 65-117

    Chen, Prof. Dr. Zengtao (et al.)

  • Coupled Thermal Stresses in Advanced Smart Materials

    Pages 119-170

    Chen, Prof. Dr. Zengtao (et al.)

  • Thermal Fracture of Advanced Materials Based on Fourier Heat Conduction

    Pages 171-242

    Chen, Prof. Dr. Zengtao (et al.)

Buy this book

eBook $109.00
price for USA (gross)
  • ISBN 978-3-030-25201-4
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $179.99
price for USA
  • ISBN 978-3-030-25200-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.

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Bibliographic Information

Bibliographic Information
Book Title
Advanced Thermal Stress Analysis of Smart Materials and Structures
Authors
Series Title
Structural Integrity
Series Volume
10
Copyright
2020
Publisher
Springer International Publishing
Copyright Holder
Springer Nature Switzerland AG
eBook ISBN
978-3-030-25201-4
DOI
10.1007/978-3-030-25201-4
Hardcover ISBN
978-3-030-25200-7
Series ISSN
2522-560X
Edition Number
1
Number of Pages
X, 304
Number of Illustrations
60 b/w illustrations, 44 illustrations in colour
Topics