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Split Manufacturing of Integrated Circuits for Hardware Security and Trust

Methods, Attacks and Defenses

  • Book
  • © 2021

Overview

  • Provides the first book on Split Manufacturing methods, attacks and defenses for integrated circuits
  • Serves as single-source reference to all advances to-date on split manufacturing methods and design splitting techniques for 2D, 2.5D and 3D integrated circuits, design recovery attacks and defense methods
  • Covers design constraint based attacks and satisfiability based attacks to reverse engineer split designs or to insert hardware trojans
  • Covers design-for-trust defense techniques to thwart both reverse engineering and trojan insertion attacks
  • Discusses the security benefits and cost penalties of various split design methods
  • Includes challenges and emerging research directions

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Table of contents (6 chapters)

Keywords

About this book

Globalization of the integrated circuit (IC) supply chains led to many potential vulnerabilities. Several attack scenarios can exploit these vulnerabilities to reverse engineer IC designs or to insert malicious trojan circuits.

Split manufacturing refers to the process of splitting an IC design into multiple parts and fabricating these parts at two or more foundries such that the design is secure even when some or all of those foundries are potentially untrusted. Realizing its security benefits, researchers have proposed split fabrication methods for 2D, 2.5D, and the emerging 3D ICs. Both attack methods against split designs and defense techniques to thwart those attacks while minimizing overheads have steadily progressed over the past decade.

This book presents a comprehensive review of the state-of-the-art and emerging directions in design splitting for secure split fabrication, design recognition and recovery attacks against split designs, and design techniquesto defend against those attacks. Readers will learn methodologies for secure and trusted IC design and fabrication using split design methods to protect against supply chain vulnerabilities.


Authors and Affiliations

  • University of Cincinnati, Cincinnati, USA

    Ranga Vemuri

  • University of Cincinnat, presently with Apple Inc., Cincinnati, USA

    Suyuan Chen

About the authors

Ranga Vemuri has been on the faculty of the Electrical  Engineering and Computer Science Department at the University of Cincinnati since 1989 and is currently a Professor. He directs the Digital Design Environments Lab. His interests span various topics within Hardware Trust, Correctness and Security; VLSI Design and Architectures; Formal Methods and Formal Verification; Electronic Design Automation; Reconfigurable Computing and FPGAs. He and his students have published over 300 papers and have received several Best Paper Awards and nominations. Prof. Vemuri graduated 42 PhD and  90 MS students. His research has been funded by AFRL, DAGSI, DARPA, NSF, State of Ohio and various industries including EDAptive Computing Inc.  Prof. Vemuri was an Associate Editor of the IEEE Transactions on VLSI and a Guest Editor of the IEEE Computer.

 

Suyuan Chen received a Ph.D. degree in Electrical Engineering from the University of Cincinnati in 2019. Currently, he is an ASIC Engineer at Apple Inc. where his work deals with SoC design using state-of-the-art 7nm, 5nm and 3nm CMOS technologies. His interests span a variety of topics in Hardware Security, LSI/AMS IC Design Methodologies, and Computer Aided Design. 

Bibliographic Information

  • Book Title: Split Manufacturing of Integrated Circuits for Hardware Security and Trust

  • Book Subtitle: Methods, Attacks and Defenses

  • Authors: Ranga Vemuri, Suyuan Chen

  • DOI: https://doi.org/10.1007/978-3-030-73445-9

  • Publisher: Springer Cham

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Switzerland AG 2021

  • Hardcover ISBN: 978-3-030-73444-2Published: 26 May 2021

  • Softcover ISBN: 978-3-030-73447-3Published: 27 May 2022

  • eBook ISBN: 978-3-030-73445-9Published: 25 May 2021

  • Edition Number: 1

  • Number of Pages: XXIX, 193

  • Number of Illustrations: 8 b/w illustrations, 47 illustrations in colour

  • Topics: Circuits and Systems, Cyber-physical systems, IoT

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