Overview
- Editors:
-
-
C. J. Hoogendoorn
-
J. M. Burgers Centre for Fluid Mechanics, Delft University of Technology, Delft, The Netherlands
-
R. A. W. M. Henkes
-
J. M. Burgers Centre for Fluid Mechanics, Delft University of Technology, Delft, The Netherlands
-
C. J. M. Lasance
-
Philips B.V., Eindhoven, The Netherlands
Access this book
Other ways to access
Table of contents (29 papers)
-
-
Invited Lectures
-
-
-
- Avram Bar-Cohen, Sorin Witzman
Pages 25-42
-
Numerical and Experimental Analysis of Systems
-
-
- S. Drake, M. White, A. Felthouse, C. Ganderton, S. Glanfield
Pages 45-54
-
- J. D. Parry, D. G. Tatchell
Pages 55-64
-
- H. Bruneel, B. Beernaert, G. Mortier, J. Declercq, B. Boesmans, W. Temmerman et al.
Pages 65-74
-
- J. L. Blanchard, J. M. Morelle
Pages 75-84
-
-
Numerical and Experimental Analysis of Channels
-
-
- C. Di Perna, A. Evangelisti, M. Paroncini, R. Ricci
Pages 97-106
-
- J. B. Saulnier, H. Y. Wang, B. Fourka
Pages 107-116
-
- O. Manca, S. Nardini, V. Naso
Pages 117-126
-
Numerical and Experimental Analysis of Electronic Parts
-
Front Matter
Pages 127-127
-
- N. Ottavy, M. Bourhrara, J. -P. Le Jannou, P. Paris
Pages 129-138
-
- G. Wachutka, J. Funk, H. Baltes
Pages 139-148
-
-
-
- J. Alkhoja, D. Rauly, F. Grandjean
Pages 169-178
About this book
The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she· had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.